In the race to dominate high-end AI chip manufacturing, breakthroughs often hinge on the synergy of cutting-edge architecture, advanced algorithms, and—perhaps surprisingly—precision chemicals. On January 29, 2026, Alibaba Cloud’s affiliate Pingtuo Ge unveiled the "Zhenwu 810E" AI chip, a landmark product developed by the "Tongyun Ge" ecosystem (Tongyi Laboratory + Alibaba Cloud + Pingtuo Ge) that rivals NVIDIA’s H20. Boasting 96GB HBM2e memory, 700GB/s inter-chip bandwidth, and deployment in 10,000-node clusters serving over 400 clients (including State Grid and Xpeng Motors), the Zhenwu 810E’s success is underpinned by two critical wet electronic chemicals: polyethyleneamine (PEPA) and triethylenetetramine (TETA). These "invisible cornerstones" play irreplaceable roles in wafer manufacturing and chip packaging, proving that high-performance semiconductors depend as much on micro-level chemical precision as macro-level design.
Key Role 1: PEPA – The Purity Guardian of Wafer Manufacturing
Polyethyleneamine (PEPA) stands out for its high amino density, strong adsorption capacity, and exceptional thermal stability (decomposition temperature >300°C), making it indispensable in two core stages of Zhenwu 810E’s wafer production.
Post-CMP Cleaning: Eliminating Nano-Scale Contaminants
After chemical mechanical planarization (CMP)—a process that smooths wafer surfaces—even minute impurities (metal ions like Cu²⁺ and Al³⁺, and nanoparticles <10nm) can cause circuit shorts or performance degradation. PEPA, diluted to 0.1%–5% with deionized water, acts as a high-precision cleaning agent. It achieves a metal ion removal rate exceeding 99.9%, ensuring wafer purity at the nano level, while only 0.1–2mL of PEPA solution is required per wafer—balancing performance with cost efficiency. Unlike traditional acid-based cleaners, PEPA’s selective adsorption targets only contaminants, avoiding damage to the silicon wafer surface and preserving micro-nano structures.
EUV Photoresist Stripping: Enhancing Imaging Accuracy
Extreme ultraviolet (EUV) lithography, critical for fabricating the Zhenwu 810E’s intricate circuits, leaves behind photoresist residues that must be completely removed to ensure pattern integrity. PEPA decomposes these residues efficiently, boosting imaging accuracy and laying the groundwork for high chip yields. Additionally, its biodegradable nature aligns with global environmental regulations, reducing the ecological footprint of chip manufacturing.
Key Role 2: TETA – The Reliability Booster for Chip Packaging & Interconnection
Triethylenetetramine (TETA) (CAS No. 112-24-3, molecular formula C₆H₁₈N₄) is a versatile polyamine with multiple functional groups, high reactivity, and low moisture absorption (<1%). It shines in the Zhenwu 810E’s packaging and interconnection stages, where mechanical strength and signal stability are non-negotiable.
Epoxy Resin Curing Agent for Underfill
In chip packaging, underfill adhesive (Underfill) protects delicate solder joints from thermal stress and mechanical damage. TETA serves as a core curing agent in this adhesive, accounting for 9.2% of the underfill formula with a mere 0.225mg used per 7mm×7mm packaged chip. It boosts peel strength to 8–10N/mm, significantly enhancing the chip’s resistance to vibration and temperature fluctuations, while withstanding 260°C reflow soldering (meeting the JEDEC MSL-1 standard for high-reliability electronics). Compared to acid anhydride-based curing systems, TETA reduces costs by 44%, supporting large-scale production without compromising performance.
Electroplating Additive for Copper Interconnection Layers
Copper interconnection layers are the "nervous system" of the chip, transmitting electrical signals between components. TETA acts as an additive in electroplating solutions, optimizing the uniformity of copper deposits and controlling porosity to <0.1%—critical for minimizing signal loss and ensuring long-term stability. Batch-to-batch quality uniformity (a hallmark of trusted TETA suppliers like Achilles Chemical) ensures reliable electroplating results, avoiding defects that could compromise chip functionality.
Synergistic Value: PEPA & TETA’s Complementary Strengths
The Zhenwu 810E’s success relies on the complementary strengths of PEPA and TETA, which together form a "purity + reliability" ecosystem. PEPA’s molecular formula is (C₂H₅)₂N-CH₂-CH₂-NH₂, with core applications in wafer post-CMP cleaning and EUV photoresist stripping—delivering a metal removal rate >99.9% and decomposition temperature >300°C, along with biodegradable, low-toxicity environmental traits. TETA, as a linear polyethyleneamine with the formula C₆H₁₈N₄, excels in chip underfill curing and copper interconnection electroplating, offering peel strength of 8–10N/mm, porosity control <0.1%, 260°C reflow resistance, and low global warming potential (GWP). PEPA ensures the wafer’s pristine condition, while TETA reinforces the chip’s structural and electrical integrity—enabling the Zhenwu 810E to deliver consistent performance in AI training, autonomous driving, and other high-demand scenarios.
Why High-Quality PEPA & TETA Matter for Semiconductor Innovation
The Zhenwu 810E’s market success—with strong demand and derived models of Alibaba’s Qianwen (Thousand Question) large model exceeding 200,000 on Hugging Face (1 billion+ downloads)—highlights the criticality of premium chemical materials in semiconductor manufacturing. For chipmakers, partnering with trusted suppliers of PEPA and TETA offers three key advantages:
1. Performance Consistency
Semiconductors require ultra-tight tolerances. High-purity PEPA and TETA (like Achilles Chemical’s TETA, a reliable alternative to Huntsman, BASF, and Dow Chemical) ensure batch-to-batch uniformity, avoiding process variations that lead to yield losses.
2. Compliance & Sustainability
Global semiconductor manufacturers face increasing pressure to adopt eco-friendly processes. PEPA’s biodegradability and TETA’s low GWP meet strict environmental regulations, reducing regulatory risks and enhancing brand reputation.
3. Cost-Effective Scalability
Both chemicals deliver exceptional performance at low consumption rates, with TETA’s 44% cost advantage over acid anhydride systems supporting large-scale production—critical for meeting the surging demand for high-end AI chips.
Future Outlook: Chemical Innovation Fueling Chip Advancement
As Alibaba’s "Tongyun Ge" ecosystem continues to iterate and domestic AI chipmakers push performance boundaries, the demand for high-performance PEPA, TETA, and related wet electronic chemicals will grow. Innovations in chemical formulation—such as higher thermal stability, improved selectivity, and lower environmental impact—will further unlock the potential of next-generation semiconductors. For chemical suppliers, this presents an opportunity to deepen collaboration with chipmakers, co-developing tailored solutions that address evolving manufacturing needs.
Conclusion: The "Invisible" Enablers of Chinese Chip Leadership
The Zhenwu 810E’s breakthrough is a testament to China’s "full-chain capability" in AI—from large models and cloud infrastructure to chip design and manufacturing. Yet, it also underscores a often-overlooked truth: semiconductors are a team effort, where chemicals like PEPA and TETA play as vital a role as hardware and software. As the global AI race intensifies, the ability to source high-quality, precision chemicals will remain a key differentiator for chipmakers. For businesses looking to support or leverage next-generation AI chips, understanding the value of these "invisible enablers" is essential—proving that in the world of high-performance semiconductors, success lies in mastering both the big picture and the smallest chemical details.
